Anterwell Technology Ltd.
Large Original stock of IC Electronics Components, Transistors, Diodes etc.
High Quality, Reasonable Price, Fast Delivery.
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Ambient Temperature Under Bias: | -55°C To +125°C | Storage Temperature: | -65°C To +150°C |
---|---|---|---|
Total Power Dissipation: | 1.0W | Maximum Current Out Of VSS Pin: | 300 MA |
Maximum Current Into VDD Pin: | 250 MA | Maximum Output Current Sunk By Any I/O Pin: | 25 MA |
Highlight: | electronic integrated circuit,linear integrated circuits |
PIC18FXX2
28/40-pin High Performance, Enhanced FLASH Microcontrollers with 10-Bit A/D
High Performance RISC CPU:
• C compiler optimized architecture/instruction set
- Source code compatible with the PIC16 and PIC17 instruction sets
• Linear program memory addressing to 32 Kbytes
• Linear data memory addressing to 1.5 Kbytes
• Up to 10 MIPs operation:
- DC - 40 MHz osc./clock input
- 4 MHz - 10 MHz osc./clock input with PLL active
• 16-bit wide instructions, 8-bit wide data path
• Priority levels for interrupts
• 8 x 8 Single Cycle Hardware Multiplier
Peripheral Features:
• High current sink/source 25 mA/25 mA
• Three external interrupt pins
• Timer0 module: 8-bit/16-bit timer/counter with 8-bit programmable prescaler
• Timer1 module: 16-bit timer/counter
• Timer2 module: 8-bit timer/counter with 8-bit period register (time-base for PWM)
• Timer3 module: 16-bit timer/counter
• Secondary oscillator clock option - Timer1/Timer3
• Two Capture/Compare/PWM (CCP) modules. CCP pins that can be configured as:
- Capture input: capture is 16-bit, max. resolution 6.25 ns (TCY/16)
- Compare is 16-bit, max. resolution 100 ns (TCY)
- PWM output: PWM resolution is 1- to 10-bit,
max. PWM freq. @: 8-bit resolution = 156 kHz
10-bit resolution = 39 kHz
• Master Synchronous Serial Port (MSSP) module, Two modes of operation:
- 3-wire SPI™ (supports all 4 SPI modes)
- I2C™ Master and Slave mode
Peripheral Features (Continued):
• Addressable USART module:
- Supports RS-485 and RS-232
• Parallel Slave Port (PSP) module
Analog Features:
• Compatible 10-bit Analog-to-Digital Converter module (A/D) with:
- Fast sampling rate
- Conversion available during SLEEP
- Linearity ≤ 1 LSb
• Programmable Low Voltage Detection (PLVD)
- Supports interrupt on-Low Voltage Detection
• Programmable Brown-out Reset (BOR)
Special Microcontroller Features:
• 100,000 erase/write cycle Enhanced FLASH program memory typical
• 1,000,000 erase/write cycle Data EEPROM memory
• FLASH/Data EEPROM Retention: > 40 years
• Self-reprogrammable under software control
• Power-on Reset (POR), Power-up Timer (PWRT) and Oscillator Start-up Timer (OST)
• Watchdog Timer (WDT) with its own On-Chip RC Oscillator for reliable operation
• Programmable code protection
• Power saving SLEEP mode
• Selectable oscillator options including:
- 4X Phase Lock Loop (of primary oscillator)
- Secondary Oscillator (32 kHz) clock input
• Single supply 5V In-Circuit Serial Programming™ (ICSP™) via two pins
• In-Circuit Debug (ICD) via two pins
CMOS Technology:
• Low power, high speed FLASH/EEPROM technology
• Fully static design
• Wide operating voltage range (2.0V to 5.5V)
• Industrial and Extended temperature ranges
• Low power consumption:
- < 1.6 mA typical @ 5V, 4 MHz
- 25 µA typical @ 3V, 32 kHz
- < 0.2 µA typical standby current
Pin Diagrams
Absolute Maximum Ratings (†)
Ambient temperature under bias.............................................................................-55°C to +125°C
Storage temperature ............................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD, MCLR, and RA4) ......... -0.3V to (VDD + 0.3V)
Voltage on VDD with respect to VSS .......................................................................... -0.3V to +7.5V
Voltage on MCLR with respect to VSS (Note 2) .......................................................... 0V to +13.25V
Voltage on RA4 with respect to Vss................................................................................ 0V to +8.5V
Total power dissipation (Note 1) ...............................................................................................1.0W
Maximum current out of VSS pin ...........................................................................................300 mA
Maximum current into VDD pin ..............................................................................................250 mA
Input clamp current, IIK (VI < 0 or VI > VDD).......................................................................... ±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD) .................................................................. ±20 mA
Maximum output current sunk by any I/O pin............................................................................25 mA
Maximum output current sourced by any I/O pin ......................................................................25 mA
Maximum current sunk by PORTA, PORTB, and PORTE (Note 3) (combined)........................200 mA
Maximum current sourced by PORTA, PORTB, and PORTE (Note 3) (combined)...................200 mA
Maximum current sunk by PORTC and PORTD (Note 3) (combined).......................................200 mA
Maximum current sourced by PORTC and PORTD (Note 3) (combined)..................................200 mA
Note
1: Power dissipation is calculated as follows: Pdis = VDD x {IDD - ∑ IOH} + ∑ {(VDD-VOH) x IOH} + ∑(VOl x IOL)
2: Voltage spikes below VSS at the MCLR/VPP pin, inducing currents greater than 80 mA, may cause latchup. Thus, a series resistor of 50-100Ω should be used when applying a “low” level to the MCLR/VPP pin, rather than pulling this pin directly to VSS.
3: PORTD and PORTE not available on the PIC18F2X2 devices.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
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