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Storage Temperature Range: | −55~125 °C | Operating Temperature Range: | −55~100 °C |
---|---|---|---|
Lead Soldering Temperature: | 260 (10 S) °C | Isolation Voltage: | 5000 (AC, 1min., R.H.≤ 60%) Vrms |
Highlight: | electronic integrated circuit,linear integrated circuits |
TLP621-2 PROGRAMMABLE CONTROLLER AC/DC-INPUT MODULE SOLID STATE RELAY
The TOSHIBA TLP621, −2 and −4 consists of a photo−transistor
optically coupled to a gallium arsenide infrared emitting diode. The
TLP621−2 offers two isolated channels in an eight lead plastic DIP,
which the TLP621−4 provides four isolated channels in a sixteen plastic DIP.
• Collector−emitter voltage: 55 V (min.)
• Current transfer ratio: 50% (min.) Rank GB: 100% (min.)
Absolute Maximum Ratings (Ta = 25°C)
Characteristic | Symbol | Rating | Unit | ||
TLP621 | TLP621−2 TLP621−4 |
||||
L E D |
Forward current | IF | 60 | 50 | mA |
Forward current derating | ΔIF /°C | −0.7 (Ta > 39°C) | −0.5 (Ta = 25°C) | mA /°C | |
Pulse forward current | IFP | 1 (100μs pulse, 100pps) | A | ||
Power dissipation | PD | 100 | 70 | mW | |
Power dissipation derating | ΔPD /°C | −1.0 | −0.7 | mW /°C | |
Reverse voltage | VR | 5 | V | ||
Junction temperature | Tj | 125 | °C | ||
D e t e c t o r |
Collector−emitter voltage | VCEO | 55 | V | |
Emitter−collector voltage | VECO | V | V | ||
Collector current | IC | 50 | mA | ||
Collector power dissipation (1 circuit) |
PC | 150 | 100 | mW | |
Collector power dissipation derating (1 circuit, Ta ≥ 25°C) | ΔPC /°C | −1.5 | −1.0 | mW /°C | |
Junction temperature | Tj | 125 | °C | ||
Storage temperature range | Tstg | −55~125 | °C | ||
Operating temperature range | Topr | −55~100 | °C | ||
Lead soldering temperature | Tsol | 260 (10 s) | °C | ||
Total package power dissipation | PT | 250 | 150 | mW | |
Total package power dissipation derating (Ta ≥ 25°C) | ΔPT /°C | −2.5 | −1.5 | mW /°C | |
Isolation voltage (Note 1) | BVS | 5000 (AC, 1min., R.H.≤ 60%) | Vrms |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage
and the significant change in temperature, etc.) may cause this product to decrease in the relia
-bility significantly even if the operating conditions (i.e. operating temperature/current/voltage,
etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon
reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating
Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
(Note 1) Device considered a two terminal: LED side pins shorted together, and detector side pins shorted together.
Recommended Operating Conditions
Characteristic | Symbol | Min. | Typ. | Max. | Unit |
Supply voltage | VCC | ― | 5 | 24 | V |
Forward current | IF | ― | 16 | 20 | mA |
Collector current | IC | ― | 1 | 10 | mA |
Operating temperature | Topr | −25 | ― | 85 | °C |
Note: Recommended operating conditions are given as a design guideline to
obtain expected performance of the device. Additionally, each item is an
independent guideline respectively. In developing designs using this pro
-duct, please confirm specified characteristics shown in this document.
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