Sn7406n Hex Inverter Buffers / Drivers Integrated Circuit Chip With Open Collector

SN7406N
HEX INVERTER BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS

•Convert TTL Voltage Levels to MOS Levels
•High Sink-Current Capability
•Input Clamping Diodes Simplify System Design
•Open-Collector Drivers for Indicator Lamps and Relays
•Inputs Fully Compatible With Most TTL Circuits

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†

Supply voltage, VCC (see Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  7 V

Input voltage, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  5.5 V

Output voltage, VO (see Notes 1 and 2): SN5406, SN7406 . . . . . . . . . . . . . . . . . . . . . . .  30 V
                                                                SN5416, SN7416 15 V . . . . . . . . . . . . . . . . . . .  15 V
Package thermal impedance, θJA (see Note 3): D package 86 . . . . . . . . . . . . . . . . . . . . . 86°C/W

                                                                           N package 80 . . . . . . . . . . . . . . . . . . . . . 80°C/W

                                                                           NS package 76 . . . . . . . . . . . . . . . . . . . . 76°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65°C to 150°C

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. Voltage values are with respect to network ground terminal

              2. This is the maximum voltage which should be applied to any output when it is in the off state

              3. The package thermal impedance is calculated in accordance with JESD 51-7.

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