Anterwell Technology Ltd.
Large Original stock of IC Electronics Components, Transistors, Diodes etc.
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Temperature Under Bias: | -55° C To +125° C | Storage Temperature: | -65° C To +150° C |
---|---|---|---|
All Input Voltages (including NC Pins) With Respect To Ground: | -0.6V To +6.25V | All Output Voltages With Respect To Ground: | -0.6V To VCC + 0.6V |
Operating Temperature (Case): | -40° C To 85° C | VCC Power Supply: | 2.7V To 3.6V |
Highlight: | electronic chip board,electronic components ic |
1-megabit 2.7-volt Minimum DataFlash AT45DB011D
Features
• Single 2.7V to 3.6V Supply
• RapidS® Serial Interface: 66 MHz Maximum Clock Frequency
– SPI Compatible Modes 0 and 3
• User Configurable Page Size
– 256 Bytes per Page
– 264 Bytes per Page
– Page Size Can Be Factory Pre-configured for 256 Bytes
• Page Program Operation
– Intelligent Programming Operation
– 512 Pages (256/264 Bytes/Page) Main Memory
• Flexible Erase Options
– Page Erase (256 Bytes)
– Block Erase (2 Kbytes)
– Sector Erase (32 Kbytes)
– Chip Erase (1 Mbits)
• One SRAM Data Buffer (256/264 Bytes)
• Continuous Read Capability through Entire Array
– Ideal for Code Shadowing Applications
• Low-power Dissipation
– 7 mA Active Read Current Typical
– 25 µA Standby Current Typical
– 5 µA Deep Power-down Typical
• Hardware and Software Data Protection Features
– Individual Sector
• Sector Lockdown for Secure Code and Data Storage
– Individual Sector
• Security: 128-byte Security Register
– 64-byte User Programmable Space
– Unique 64-byte Device Identifier
• JEDEC Standard Manufacturer and Device ID Read
• 100,000 Program/Erase Cycles Per Page Minimum
• Data Retention – 20 Years
• Industrial Temperature Range
• Green (Pb/Halide-free/RoHS Compliant) Packaging Options
Description
The AT45DB011D is a 2.7V, serial-interface Flash memory ideally suited for a wide variety of digital voice-, image-, program code- and data-storage applications. The AT45DB011D supports RapidS serial interface for applications requiring very high speed operations. RapidS serial interface is SPI compatible for frequencies up to 66 MHz. Its 1,081,344 bits of memory are organized as 512 pages of 256 bytes or 264 bytes each. In addition to the main memory, the AT45DB011D also contains one SRAM buffer of 256/264 bytes. EEPROM emulation (bit or byte alterability) is easily handled with a self-contained three step read-modify-write operation. Unlike conventional Flash memories that are accessed randomly with multiple address lines and a parallel interface, the DataFlash® uses a RapidS serial interface to sequentially access its data. The simple sequential access dramatically reduces active pin count, facilitates hardware layout, increases system reliability, minimizes switching noise, and reduces package size.
The device is optimized for use in many commercial and industrial applications where high-density, low-pin count, low-voltage and low-power are essential.
To allow for simple in-system reprogrammability, the AT45DB011D does not require high input voltages for programming. The device operates from a single power supply, 2.7V to 3.6V, for both the program and read operations. The AT45DB011D is enabled through the chip select pin (CS) and accessed via a three-wire interface consisting of the Serial Input (SI), Serial Output (SO), and the Serial Clock (SCK).
All programming and erase cycles are self-timed.
Absolute Maximum Ratings*
Temperature under Bias ............................... -55° C to +125° C
Storage Temperature .................................... -65° C to +150° C
All Input Voltages (including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to VCC + 0.6V
*NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
SOIC Top View UDFN Top View(1)
Note:
1. The metal pad on the bottom of the UDFN package is floating. This pad can be a “No Connect” or connected to GND.
Block Diagram
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