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Drain-source Voltage (VGS = 0): | 600 V | Gate-source Voltage: | ± 20 V |
---|---|---|---|
Drain Current (pulsed): | 14 A | Peak Diode Recovery Voltage Slope: | 3 V/ns |
Storage Temperature: | -65 To 150 ℃ | Max. Operating Junction Temperature: | 150 ℃ |
Highlight: | npn smd transistor,multi emitter transistor |
IRFBC30
N - CHANNEL 600V - 1.8 Ω - 3.6A - TO-220 PowerMESHTM ΙΙ MOSFET
TYPE | VDSS | RDS(on) | ID |
IRFBC30 | 600 V | < 2.2 Ω | 3.6 A |
TO-220
■ TYPICAL RDS(on) = 1.8 Ω
■ EXTREMELY HIGH dv/dt CAPABILITY
■ 100% AVALANCHE TESTED
■ VERY LOW INTRINSIC CAPACITANCES
■ GATE CHARGE MINIMIZED
DESCRIPTION
The PowerMESHTM ΙΙ is the evolution of the first generation of MESH OVERLAYTM . The layout refinements introduced greatly improve the Ron*area figure of merit while keeping the device at the leading edge for what concerns switching speed, gate charge and ruggedness.
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SWITH MODE POWER SUPPLIES (SMPS)
■ DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVER
ABSOLUTE MAXIMUM RATINGS
Symbol | Parameter | Value | Unit |
VDS | Drain-source Voltage (VGS = 0) | 600 | V |
VDGR | Drain- gate Voltage (RGS = 20 kΩ) | 600 | V |
VGS | Gate-source Voltage | ± 20 | V |
ID | Drain Current (continuous) at Tc = 25 ℃ | 3.6 | A |
ID | Drain Current (continuous) at Tc = 100 ℃ | 2.3 | A |
IDM (•) | Drain Current (pulsed) | 14 | A |
Ptot | Total Dissipation at Tc = 25 ℃ | 75 | W |
Derating Factor | 0.6 | W/℃ | |
dv/dt(1) | Peak Diode Recovery voltage slope | 3 | V/ns |
Tstg | Storage Temperature | -65 to 150 | ℃ |
Tj | Max. Operating Junction Temperature | 150 | ℃ |
(•) Pulse width limited by safe operating area
( 1) ISD ≤3.6 A, di/dt ≤ 60 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
INTERNAL SCHEMATIC DIAGRAM
TO-220 MECHANICAL DATA
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