Anterwell Technology Ltd.
Large Original stock of IC Electronics Components, Transistors, Diodes etc.
High Quality, Reasonable Price, Fast Delivery.
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Total Power Dissipation On FR−5 Board, @ TL = 75°C: | 500 MW | Total Power Dissipation On FR−5 Board, Derated Above 75°C: | 6.7 MW/°C |
---|---|---|---|
Thermal Resistance, Junction−to−Ambient: | 340 °C/W | Thermal Resistance, Junction−to−Lead: | 150 °C/W |
Junction And Storage Temperature Range: | −55 To +150 °C | Package: | SOD−123 (Pb−Free) |
Highlight: | diode rectifier circuit,bridge rectifier circuit |
MMSZ5230BT1G Silicon Planar Zener Diodes Rectifier Diode Zener Voltage Regulators 123 Surface Mount
Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.
Features
• 500 mW Rating on FR−4 or FR−5 Board
• Wide Zener Reverse Voltage Range − 2.4 V to 110 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• General Purpose, Medium Current
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Pb−Free Packages are Available
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MAXIMUM RATINGS
Rating | Symbol | Max | Unit |
Total Power Dissipation on FR−5 Board, (Note 1) @ TL = 75°C Derated above 75°C |
PD |
500 6.7 |
mW mW/°C |
Thermal Resistance, (Note 2) Junction−to−Ambient |
RθJA | 340 | °C/W |
Thermal Resistance, (Note 2) Junction−to−Lead |
RθJL | 150 | °C/W |
Junction and Storage Temperature Range | TJ, Tstg | −55 to +150 | °C |
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.
2. Thermal Resistance measurement obtained via infrared Scan Method.
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE C
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