Anterwell Technology Ltd.
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Gate-to-Source Voltage: | ±30 V | Pulsed Drain Current: | 180 A |
---|---|---|---|
Repetitive Peak Current: | 87 A | Power Dissipation: | 310 W |
Linear Derating Factor: | 2.0 W/°C | Soldering Temperature For 10 Seconds: | 300 °C |
Highlight: | power mosfet ic,silicon power transistors |
IRFP4229PbF PDP SWITCH
Features
• Advanced Process Technology
• Key Parameters Optimized for PDP Sustain, Energy Recovery and Pass Switch Applications
• Low EPULSE Rating to Reduce Power Dissipation in PDP Sustain, Energy Recovery and Pass Switch Applications
• Low QG for Fast Response
• High Repetitive Peak Current Capability for Reliable Operation
• Short Fall & Rise Times for Fast Switching
• 175°C Operating Junction Temperature for Improved Ruggedness
• Repetitive Avalanche Capability for Robustness and Reliability
Description
This HEXFET® Power MOSFET is specifically designed for Sustain; Energy Recovery & Pass switch applications in Plasma Display Panels. This MOSFET utilizes the latest processing techniques to achieve low on-resistance per silicon area and low EPULSE rating. Additional features of this MOSFET are 175°C operating junction temperature and high repetitive peak current capability. These features combine to make this MOSFET a highly efficient, robust and reliable device for PDP driving applications.
Absolute Maximum Ratings
Parameter | Max. | Units | |
---|---|---|---|
VGS | Gate-to-Source Voltage | ±30 | V |
ID @ TC = 25°C | Continuous Drain Current, VGS @ 10V | 44 | A |
ID @ TC = 100°C | Continuous Drain Current, VGS @ 10V | 31 | A |
IDM | Pulsed Drain Current | 180 | A |
IRP @ TC = 100°C | Repetitive Peak Current | 87 | A |
PD @TC = 25°C | Power Dissipation | 310 | W |
PD @TC = 100°C | Power Dissipation | 150 | W |
Linear Derating Factor | 2.0 | W/°C | |
TJ , TSTG | Operating Junction and Storage Temperature Range | -40 to + 175 | °C |
Soldering Temperature for 10 seconds | 300 | °C | |
Mounting Torque, 6-32 or M3 Screw | 10lbin (1.1Nm) | N |
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