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Input Voltage: | 26V | Internal Power Dissipation: | Internally Limited |
---|---|---|---|
Maximum Junction Temperature: | 150°C | Storage Temperature: | −65°C To +150°C |
ESD Susceptibility: | 2 KV | Operating Temperature: | −40°C To 125°C |
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LM2937-2.5, LM2937-3.3 400mA and 500mA Voltage Regulators
FEATURES
• Fully Specified for Operation Over −40°C to +125°C
• Output Current in Excess of 500 mA (400mA for SOT-223 package)
• Output Trimmed for 5% Tolerance Under All Operating Conditions
• Wide Output Capacitor ESR Range, 0.01Ω up to 5Ω
• Internal Short Circuit and Thermal Overload Protection
• Reverse Battery Protection
• 60V Input Transient Protection
• Mirror Image Insertion Protection
DESCRIPTION
The LM2937-2.5 and LM2937-3.3 are positive voltage regulators capable of supplying up to 500 mA of load current. Both regulators are ideal for converting a common 5V logic supply, or higher input supply voltage, to the lower 2.5V and 3.3V supplies to power VLSI ASIC's and microcontrollers. Special circuitry has been incorporated to minimize the quiescent current to typically only 10 mA with a full 500 mA load current when the input to output voltage differential is greater than 5V.
The LM2937 requires an output bypass capacitor for stability. As with most regulators utilizing a PNP pass transistor, the ESR of this capacitor remains a critical design parameter, but the LM2937-2.5 and LM2937-3.3 include special compensation circuitry that relaxes ESR requirements. The LM2937 is stable for all ESR ratings less than 5Ω. This allows the use of low ESR chip capacitors.
The regulators are also suited for automotive applications, with built in protection from reverse battery connections, two-battery jumps and up to +60V/−50V load dump transients. Familiar regulator features such as short circuit and thermal shutdown protection are also built in.
Connection Diagrams
Absolute Maximum Ratings(1)(2)
Input Voltage | Continuous | 26V |
Transient (t ≤ 100 ms) | 60V | |
Internal Power Dissipation (3) | Internally Limited | |
Maximum Junction Temperature | 150°C | |
Storage Temperature Range | −65°C to +150°C | |
Lead Temperature Soldering | TO-220 (10 seconds) | 260°C |
DDPAK/TO-263 (10 seconds) | 230°C | |
SOT-223 (Vapor Phase, 60 seconds) | 215°C | |
SOT-223 (Infrared, 15 seconds) | 220°C | |
ESD Susceptibility (4) | 2 kV |
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device outside of its rated Operating Conditions.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above 150°C, the regulator will go into thermal shutdown. The junction-to-ambient thermal resistance θJA is 65°C/W, for the TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is the sum of the device junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application Hints for more information on heatsinking).
(4) ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
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