TMS320F2811PBKA Integrated Circuit Chip Digital Signal Processors

 

TMS320F2810, TMS320F2811, TMS320F2812

TMS320C2810, TMS320C2811, TMS320C2812

Digital Signal Processors

 

Features

• High-Performance Static CMOS Technology

  − 150 MHz (6.67-ns Cycle Time)

  − Low-Power (1.8-V Core @135 MHz, 1.9-V Core @150 MHz, 3.3-V I/O) Design

• JTAG Boundary Scan Support†

• High-Performance 32-Bit CPU (TMS320C28x)

  − 16 x 16 and 32 x 32 MAC Operations

  − 16 x 16 Dual MAC

  − Harvard Bus Architecture

  − Atomic Operations

  − Fast Interrupt Response and Processing

  − Unified Memory Programming Model

  − 4M Linear Program/Data Address Reach

  − Code-Efficient (in C/C++ and Assembly)

  − TMS320F24x/LF240x Processor Source Code Compatible

 

• On-Chip Memory

  − Flash Devices: Up to 128K x 16 Flash (Four 8K x 16 and Six 16K x 16 Sectors)

  − ROM Devices: Up to 128K x 16 ROM

  − 1K x 16 OTP ROM

  − L0 and L1: 2 Blocks of 4K x 16 Each Single-Access RAM (SARAM)

  − H0: 1 Block of 8K x 16 SARAM

  − M0 and M1: 2 Blocks of 1K x 16 Each SARAM

• Boot ROM (4K x 16)

  − With Software Boot Modes

  − Standard Math Tables

 

• External Interface (2812)

  − Up to 1M Total Memory

  − Programmable Wait States

  − Programmable Read/Write Strobe Timing

  − Three Individual Chip Selects

• Clock and System Control

  − Dynamic PLL Ratio Changes Supported

  − On-Chip Oscillator

  − Watchdog Timer Module

 

• Three External Interrupts

• Peripheral Interrupt Expansion (PIE) Block That Supports 45 Peripheral Interrupts

• Three 32-Bit CPU-Timers

• 128-Bit Security Key/Lock

  − Protects Flash/ROM/OTP and L0/L1 SARAM

  − Prevents Firmware Reverse Engineering

• Motor Control Peripherals

  − Two Event Managers (EVA, EVB)

  − Compatible to 240xA Devices

 

• Serial Port Peripherals

  − Serial Peripheral Interface (SPI)

  − Two Serial Communications Interfaces (SCIs), Standard UART

  − Enhanced Controller Area Network (eCAN)

  − Multichannel Buffered Serial Port (McBSP)

• 12-Bit ADC, 16 Channels

  − 2 x 8 Channel Input Multiplexer

  − Two Sample-and-Hold

  − Single/Simultaneous Conversions

  − Fast Conversion Rate: 80 ns/12.5 MSPS

 

• Up to 56 General Purpose I/O (GPIO) Pins

• Advanced Emulation Features

  − Analysis and Breakpoint Functions

  − Real-Time Debug via Hardware

• Development Tools Include

  − ANSI C/C++ Compiler/Assembler/Linker

  − Code Composer Studio IDE

  − DSP/BIOS

  − JTAG Scan Controllers†

 

• Low-Power Modes and Power Savings

  − IDLE, STANDBY, HALT Modes Supported

  − Disable Individual Peripheral Clocks

• Package Options

  − 179-Ball MicroStar BGA With External Memory Interface (GHH), (ZHH) (2812)

  − 176-Pin Low-Profile Quad Flatpack (LQFP) With External Memory Interface (PGF) (2812)

  − 128-Pin LQFP Without External Memory Interface (PBK) (2810, 2811)

• Temperature Options:

  − A: −40°C to 85°C (GHH, ZHH, PGF, PBK)

  − S/Q: −40°C to 125°C (GHH, ZHH, PGF, PBK)

 

Introduction

This section provides a summary of each device’s features, lists the pin assignments, and describes the function of each pin. This document also provides detailed descriptions of peripherals, electrical specifications, parameter measurement information, and mechanical data about the available packaging.

 

Description

The TMS320F2810, TMS320F2811, TMS320F2812, TMS320C2810, TMS320C2811, and TMS320C2812 devices, members of the TMS320C28x DSP generation, are highly integrated, high-performance solutions for demanding control applications. The functional blocks and the memory maps are described in Section 3, Functional Overview.

 

Throughout this document, TMS320F2810, TMS320F2811, and TMS320F2812 are abbreviated as F2810, F2811, and F2812, respectively. F281x denotes all three Flash devices. TMS320C2810, TMS320C2811, and TMS320C2812 are abbreviated as C2810, C2811, and C2812, respectively. C281x denotes all three ROM devices. 2810 denotes both F2810 and C2810 devices; 2811 denotes both F2811 and C2811 devices; and 2812 denotes both F2812 and C2812 devices.

 

Absolute Maximum Ratings

Unless otherwise noted, the list of absolute maximum ratings are specified over operating temperature ranges. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Section 6.2 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to VSS.

 

Supply voltage range, V_DDIO, V_DDA1, V_DDA2, V_DDAIO, and AV_DDREFBG . . . . . . . . . . . − 0.3 V to 4.6 V

Supply voltage range, V_DD, V_DD1  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 0.5 V to 2.5 V

V_DD3VFL range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  − 0.3 V to 4.6 V

Input voltage range, V_IN  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  − 0.3 V to 4.6 V

Output voltage range, V_O  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  − 0.3 V to 4.6 V

Input clamp current, I_IK (V_IN < 0 or V_IN > V_DDIO)^† . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  ± 20 mA

Output clamp current, I_OK (V_O < 0 or V_O > V_DDIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA

Operating ambient temperature ranges, TA: A version (GHH, PGF, PBK)‡  . . . . . . . . . . − 40°C to 85°C

                                                                TA: S version (GHH, PGF, PBK)‡§  . . . . . . . . − 40°C to 125°C

                                                                TA: Q version (GHH, PGF, PBK)‡  . . . . . . . . . − 40°C to 125°C

Storage temperature range, T_stg^†  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 65°C to 150°C

---

† Continuous clamp current per pin is± 2 mA

‡ Long-term high-temperature storage and/or extended use at maximum temperature conditions may result in a reduction of overall device life. For additional information, see IC Package Thermal Metrics Application Report (literature number SPRA953) and Reliability Data for TMS320LF24x and TMS320F281x Devices Application Report (literature number SPRA963).

§ Replaced by Q temperature option from silicon revision E onwards

 

 

 

 

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Package

LMH0346MH	973	NSC	14+	TSSOP-20
LMH0302SQE	743	TI	14+	WQFN-16
OP37GSZ	6220	AD	16+	SOP
LM2990T-5.0	500	NSC	10+	TO-220
MAX527DCWG+	500	MAXIM	10+	SOP
NLC565050T-271K-PF	10000	TDK	16+	SMD
MT29F2G08ABAEAH4:E	6946	MICRON	12+	BGA
BFS17P	9000	NXP	15+	SOT23
L702N	1486	ST	14+	ZIP11
LM3900N	3799	NSC	14+	DIP-14
LMC6482IMM	3872	NSC	14+	MSOP-8
X25043P	2010	XICOR	12+	DIP-8
LNK623DG	5011	POWER	14+	SOP-7
PIC18LF8722-I/PT	4198	MICROCHIP	14+	QFP
PEF2256HV2.1	6050		15+	QFP
LM5033MM	964	NSC	13+	MSOP-10
NJU6355ED	3000	JRC	16+	DIP
XC5VLX110T-1FFG1136C	100	XILINX	15+	BGA
MT41J64M16JT-15EIT:G	7037	MICRON	16+	BGA
XC5VSX95T-1FFG1136I	88	XILINX	15+	BGA
MMBT4403	20000	ON	16+	SOT-23
MP2403DN-LF	5770	MPS	16+	SOP
MAX3227EAE+T	1950	MAXIM	16+	SSOP
LTC2053CMS8#PBF	6374	LT	15+	MSOP
MAX3380ECUP+T	5655	MAXIM	16+	TSSOP
MCP101T-450I/TT	4894	MICROCHIP	16+	SOT-23
LM5118MHX	2738	NSC	15+	TSSOP-20
MAX13041ASD+T	55000	MAXIM	16+	SOP
MAX13020ASA+T	50000	MAXIM	16+	SOP
NCV2931AD-5.0R2G	14720	ON	16+	SOP-8