Anterwell Technology Ltd.
Large Original stock of IC Electronics Components, Transistors, Diodes etc.
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Storage Temperature: | –65 To 150 °C | Input And Output Voltage (with Respect To Ground): | –0.6 To 4.0 V |
---|---|---|---|
Supply Voltage: | –0.6 To 4.0 V | Electrostatic Discharge Voltage (Human Body Model): | –2000 To 2000 V |
Ambient Operating Temperature: | –40 To 85 °C | Load Capacitance: | 30 PF |
Highlight: | electronic integrated circuit,linear integrated circuits |
M25P10-A
1 Mbit, Low Voltage, Serial Flash Memory With 50MHz SPI Bus Interface
FEATURES SUMMARY
■ 1 Mbit of Flash Memory
■ Page Program (up to 256 Bytes) in 1.4ms (typical)
■ Sector Erase (256 Kbit) in 0.8s (typical)
■ Bulk Erase (1 Mbit) in 2.5s (typical)
■ 2.7 to 3.6V Single Supply Voltage
■ SPI Bus Compatible Serial Interface
■ 50MHz Clock Rate (maximum)
■ Deep Power-down Mode 1µA (typical)
■ Electronic Signature (11h)
– JEDEC Standard two-Byte Signature (2011h)
– RES Instruction, One-Byte, Signature (10h), for backward compatibility
■ More than 100,000 Erase/Program Cycles per Sector
■ More than 20 Years’ Data Retention
SUMMARY DESCRIPTION
The M25P10-A is a 1 Mbit (128K x 8) Serial Flash Memory, with advanced write protection mechanisms, accessed by a high speed SPI-compatible bus.
The memory can be programmed 1 to 256 bytes at a time, using the Page Program instruction.
The memory is organized as 4 sectors, each containing 128 pages. Each page is 256 bytes wide. Thus, the whole memory can be viewed as consisting of 512 pages, or 131,072 bytes.
The whole memory can be erased using the Bulk Erase instruction, or a sector at a time, using the Sector Erase instruction.
MAXIMUM RATING
Stressing the device above the rating listed in the Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.
Symbol | Parameter | Min. | Max. | Unit |
---|---|---|---|---|
TSTG | Storage Temperature | –65 | 150 | °C |
TLEAD | Lead Temperature during Soldering | (1) | °C | |
VIO | Input and Output Voltage (with respect to Ground) | –0.6 | 4.0 | V |
VCC | Supply Voltage | –0.6 | 4.0 | V |
VESD | Electrostatic Discharge Voltage (Human Body model) 3 | –2000 | 2000 | V |
Note:
1. Compliant with the JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK® 7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.
2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)
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